China Customized OEM Electronics PCB Assembly Printed Circuit Board SMT

• Metal Coating: Gold
• Mode of Production: SMT+DIP
• Layers: Double-Layer
• Base Material: G-10
• Certification: RoHS, CCC, ISO
• Customized: Customized
• Model NO.: HD5201453LC
• Condition: Used
• PCB Layers: 4 Layers
• OEM Assembly: Supply
• DIP Assembly: Flowflow Welding+Hand Welding
• SMT Assembly: 0201-BGA(0.1mm)
• Test: QC,Aoi,Fct,X-ray
• The Fastest Delivery Time: Sample(3-5/Day)
• Electronic Components: Keep a Large Stock of Goods
• IC Program Burning: Supply
• Design: Supply
• Transport Package: Anti-Static
• Specification: 55.5*66.7*1.2mm
• Trademark: dd
• Origin: China
• HS Code: 8542310000
• Production Capacity: 600PCS/ Day

Product Description

Printing Accuracy	0.01mm	SMT Components	01005-BGA
Screen Stencil Size/Max	737*737mm	SMT Precision	0.01mm
PCB size/max	500*500mm	SMT Line	3
pressure	0.5-10eg	DIP Line	1
air source	4-6kgf/cm2	SMT Capacity	360000CPH
PCB Weight	0-3kg	DIP Capacity	100000CPH
QC Personnel	5	AOI	3
Develoment and design Personnel	4	Electrons Components	keep a large stock of goods

 

 Shenzhen haodley Technology Co.,Ltd provides one-stop electronic OEM/ODM services,from IC programming,Electronic Design,components sell,PCB production,SMT assembly,DIP assembly,hand soldering,PCBA testing,case assembly to finished products. Since its establishment in 2016, our products are widely used in computer, audio, digital products, household appliances, automotive, medical, mobile phones, automation equipment, communication products and other industries. Our production lines are equipped with automatic machines totally high speed and high accuracy. Our min. SMD component precision can meet 01005, and THT precision down to 0.6mm, skilled in ball grid array (BGA) assembly. All products fully conducted test, AOI test, functional text, burn-in test to secure product quality. We fully follow IPC-A-610E class II and class III standard. High-quality product, reasonable price, fast delivery and good service are always our promise.